封装微处理器不可插入微波测试装置的直接表征

Joseph D. King, Ben Biron
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引用次数: 1

摘要

用于测试封装mmic的不可插入微波装置通常被设计为从信号源处的同轴环境过渡到被测器件(DUT)处的微带或共面波导(CPW)传输线。在电气性能测试期间,该传输线成为自动测试设备(ATE)和封装MMIC引线之间的接口。由于校准参考平面在同轴连接器上,而不是在被测设备上,因此需要对测量结果进行校正,以补偿中间结构。由于网络分析仪不能直接连接到微带或CPW传输线,因此很难直接测量这种中间结构的特性。由于需要在混合连接环境中使用的网络分析仪的一组校准系数,该任务进一步复杂化。本文提出了一种不使用脱嵌程序直接准确表征不可插入MMIC测试夹具电气性能的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Direct Characterization of Non-Insertable Microwave Test Fixtures for Packaged MMICs
Non-Insertable Microwave fixtures used for testing packaged MMICs are often designed to transition from a coaxial environment at the signal source to either a microstrip or coplanar waveguide (CPW) transmission line at the Device Under Test (DUT). This transmission line becomes the interface between the automatic test equipment (ATE) and a lead of a packaged MMIC during electrical performance testing. Since the calibration reference plane is at the coaxial connector and not at the device under test, the measurements need to be corrected to compensate for the intervening structure. Because the network analyzer cannot be directly connected to the microstrip or CPW transmission line, it is difficult to directly measure the characteristics of this intervening structure. The task is further complicated by the need for a single set of calibration coefficients for a network analyzer that is to be used in a mixed connection environment. This paper presents one solution to the problem of directly and accurately characterizing the electrical performance of non-insertable MMIC test fixtures without using de-embedding procedures.
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