优化测试/诊断/返工位置(s)和特点,在电子系统装配使用实时编码遗传算法

Zhen Shi, P. Sandborn
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引用次数: 2

摘要

本文提出了一个优化电子系统装配过程中测试/诊断/返工(TDR)操作的位置和特征(故障覆盖率/测试成本、返工成功率/返工成本)的框架。提出了一种新的搜索算法,称为等待序列搜索(WSS),用于遍历一般的工艺流程,以便对产生的成本目标函数进行累积计算。实际编码遗传算法(RCGAs)用于执行多变量优化,使生产成本最小化。分析了几个简单的案例进行验证,并使用一个一般的复杂流程来证明该算法的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of test/diagnosis/rework location(s) and characteristics in electronic systems assembly using real-coded genetic algorithms
This paper presents a framework for optimizing the location(s) and characteristics (fault coverage/test cost, rework success rate/rework cost) of Test/Diagnosis/Rework (TDR) operations in the assembly process for electronic systems. A new search algorithm called Waiting Sequence Search (WSS) is applied to traverse a general process flow in order to perform the cumulative calculation of a yielded cost objective function. Real-Coded Genetic Algorithms (RCGAs) are used to perform a multi-variable optimization that minimizes yielded cost. Several simple cases are analyzed for validation and a general complex process flow is used to demonstrate the applicability of the algorithm.
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