新型各向异性导电膜(ACF)

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298744

A. Yokoyama, K. Maehara, K. Takagi

{"title":"新型各向异性导电膜(ACF)","authors":"A. Yokoyama, K. Maehara, K. Takagi","doi":"10.1109/EPTC.2003.1298744","DOIUrl":null,"url":null,"abstract":"Asahikasei has originally developed the new conductive powder AMG/sup R/ which has a specific structure mainly composed of copper and a small amount of silver, wherein its particle's surface is quite rich in silver component in spite of containing a small amount of silver throughout the particle. The configuration of AMG are summarized here: (1) the Cu-Ag alloy powder is mainly composed of copper and a small amount of silver; (2) the particle surface is rich in silver component; (3) the shape is nearly spherical. Thanks to this specific structure, AMG shows excellent performance, such as high electroconductivity due to its composition of copper and silver, excellent reliability and less ion-migration because of its specific structure when applied to ACF.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"New anisotropic conductive film (ACF)\",\"authors\":\"A. Yokoyama, K. Maehara, K. Takagi\",\"doi\":\"10.1109/EPTC.2003.1298744\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Asahikasei has originally developed the new conductive powder AMG/sup R/ which has a specific structure mainly composed of copper and a small amount of silver, wherein its particle's surface is quite rich in silver component in spite of containing a small amount of silver throughout the particle. The configuration of AMG are summarized here: (1) the Cu-Ag alloy powder is mainly composed of copper and a small amount of silver; (2) the particle surface is rich in silver component; (3) the shape is nearly spherical. Thanks to this specific structure, AMG shows excellent performance, such as high electroconductivity due to its composition of copper and silver, excellent reliability and less ion-migration because of its specific structure when applied to ACF.\",\"PeriodicalId\":201404,\"journal\":{\"name\":\"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2003.1298744\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2003.1298744","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

旭晖最初开发的新型导电粉末AMG/sup R/具有以铜和少量银为主要成分的特定结构，其颗粒表面虽然含有少量的银，但银成分却相当丰富。AMG的结构总结如下:(1)Cu-Ag合金粉末主要由铜和少量银组成;(2)颗粒表面富含银成分;(3)形状接近球形。由于这种特殊的结构，AMG在应用于ACF时表现出优异的性能，例如由于其铜和银的组成而具有高导电性，由于其特殊的结构而具有优异的可靠性和较少的离子迁移。

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New anisotropic conductive film (ACF)

Asahikasei has originally developed the new conductive powder AMG/sup R/ which has a specific structure mainly composed of copper and a small amount of silver, wherein its particle's surface is quite rich in silver component in spite of containing a small amount of silver throughout the particle. The configuration of AMG are summarized here: (1) the Cu-Ag alloy powder is mainly composed of copper and a small amount of silver; (2) the particle surface is rich in silver component; (3) the shape is nearly spherical. Thanks to this specific structure, AMG shows excellent performance, such as high electroconductivity due to its composition of copper and silver, excellent reliability and less ion-migration because of its specific structure when applied to ACF.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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