电离氢气氛中GaSb单晶的退火

B. Štěpánek, V. Šestákova, J. Šesták
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引用次数: 2

摘要

将未掺杂的GaSb硅片在100 ~ 350℃的离子化氢气氛中退火1 ~ 50小时。测量了自由载流子浓度和电阻率。结果表明,在150℃温度下处理24小时后,晶圆的电阻率约为102 ~ 103 (Omega) cm,自由载流子浓度小于1 × 1015 cm-3。而钝化层的厚度仅为0.4 ~ 0.6微米。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Annealing of GaSb single crystals in ionized hydrogen atmosphere
GaSb undoped wafer were annealed in flowing ionized hydrogen atmosphere at temperature range between 100-350 degrees C for 1-50 hours. The free carrier concentration and resistivity were measured. It was found out that the wafers being treated at a temperature of 150 degrees C for 24 hours reached the resistivity of about 102-103 (Omega) cm and the free carrier concentration was lower than 1 by 1015 cm-3. However, the thickness of the passivated layer was only 0.4-0.6 micrometers .
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