用于传感器和光电器件的多孔硅钝化:光学特性

Rosimara P. Toledo, C. S. Dias, D. R. Huanca, S. Zaccaro, W. J. Salcedo
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引用次数: 2

摘要

通过在hf基电解质中刻蚀p型晶体硅(c-Si),制备了不同孔隙率的多孔硅单层。高掺杂c-Si在HF:乙醇中阳极氧化得到介孔结构,而低掺杂c-Si在HF和二甲基甲酰胺溶液中蚀刻得到大孔结构。电化学氧化后发现,根据孔隙率和剩余cSi尺寸,它们的厚度会收缩,而有效折射率(ERI)的降低与结构内氧化硅的存在有关。蚀刻、氧化和聚合物沉积的大孔硅的光学反射率表明它们是传感器和光伏应用的优良材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Porous silicon passivation for applications in sensors and photovoltaics: Optical characterization
Porous silicon monolayers with different porosities were produced by etching p-type crystalline silicon (c-Si) in HF-based electrolytes. Mesoporous structures were achieved in heavily doped c-Si anodized into HF:ethanol, whereas for macroporous ones slightly doped c-Si was etched in HF and dimethylformamide solution. After electrochemical oxidation of them, it was found that depending on both the porosity and remaining cSi size, the thickness of them becomes contracted, while the reduction of the effective refractive index (ERI) is associated to the presence of silicon oxide within the structures. The optical reflectance of the as-etched, oxidized and polymer deposited macroporous silicon shows that they are excellent materials for sensor and photovoltaic application.
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