用于BGA封装测量的宽带Through-Line-Line去嵌入技术

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967627

H. Liang, J. Laskar, M. Hyslop

{"title":"用于BGA封装测量的宽带Through-Line-Line去嵌入技术","authors":"H. Liang, J. Laskar, M. Hyslop","doi":"10.1109/EPEP.2001.967627","DOIUrl":null,"url":null,"abstract":"In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"267 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A broad band Through-Line-Line de-embedding technique for BGA package measurements\",\"authors\":\"H. Liang, J. Laskar, M. Hyslop\",\"doi\":\"10.1109/EPEP.2001.967627\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"267 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967627\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967627","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

本文提出了一种用于毫米波器件精确测量和表征的宽带直通线(TLL)去嵌入技术。当适配器或发射超过四分之一波长时，它特别有用，因为传统的适配器移除校准不适用。详细介绍了TLL组件的算法和实现。通过对毫米波BGA封装测量的去嵌入应用，证明了TLL技术在直流至50 GHz范围内的适用性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A broad band Through-Line-Line de-embedding technique for BGA package measurements

In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

自引率

0.00%

发文量