钽片电容器在高浪涌和纹波电流应用中的可靠性

E. Reed
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引用次数: 22

摘要

电子电路的不断小型化和从通孔制造到表面贴装制造的普遍运动,使表面贴装钽片电容器的使用出现了爆炸式增长。许多这些应用涉及大量暴露于浪涌和纹波电流。这种暴露引发了关于浪涌和纹波电流对钽片电容器长期可靠性的影响的问题。为了更好地理解浪涌和纹波电流对钽片电容可靠性的影响,本文通过对实验数据的讨论来支持一般电路的理论分析。简单电路强调了瞬态浪涌和稳态纹波电流应用背后的基本理论原理,并讨论了相关的可靠性问题。从理论上建立了器件等效串联电阻ESR与浪涌和纹波电流稳健性和器件温升的关系。浪涌和纹波电流的测试和测量方法进行了简要的讨论,并使用实验测试数据来支持许多从理论得出的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Tantalum chip capacitor reliability in high surge and ripple current applications
Relentless miniaturization of electronic circuitry and the general movement from through-hole to surface-mount manufacturing have generated explosive growth in the use of surface mount tantalum chip capacitors. Many of these applications involve substantial exposure to surge and ripple currents. Such exposure invites questions regarding the impact of surge and ripple current on the long-term reliability of tantalum chip capacitors. To facilitate a better understanding of the impact of surge and ripple current on tantalum chip capacitor reliability, theoretical analyses of generic circuits are supported with discussion of experimental data. Simple circuits that highlight the fundamental theoretical principles behind transient surge and steady-state ripple current applications are analyzed and pertinent reliability issues are discussed. The relationship of device ESR (equivalent series resistance) to surge and ripple current robustness and device temperature rise is established theoretically. Surge and ripple current test and measurement methods are briefly discussed and experimental test data are used to support many of the insights that are drawn from theory.<>
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