全集成伪差分k波段功率放大器在0.13um标准CMOS

Pengwei Chen, Jin He, Jiang Luo, Hao Wang, Sheng Chang, Qijun Huang, Hao Yu, Xiao-peng Yu
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引用次数: 3

摘要

采用标准130 nm CMOS工艺,在1.5 v电源电压下制作了具有片上输入输出匹配网络的k波段功率放大器(PA)模块。全集成PA模块由两级伪差分级联码结构PA和基于变压器的片上堆叠平衡组成。在26GHz时,PA实现了18.6 db的小信号增益,12.2 dbm的饱和输出功率和22.4%的功率附加效率(PAE)。该芯片占地面积为0.88 × 0.62mm2,包括所有直流和射频焊盘。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fully integrated pseudo differential K-band power amplifier in 0.13um standard CMOS
A K-band power amplifier (PA) module with on-chip input and output matching network was fabricated in standard 130-nm CMOS process with 1.5-V supply voltage. The fully integrated PA module consists of 2-stage pseudo-differential cascode configuration PA and on-chip stacked balun based on transformer. At 26GHz, the PA achieved 18.6-dB small-signal gain, 12.2-dBm saturated output power and 22.4% power added efficiency (PAE). The chip occupies an area of 0.88 × 0.62mm2, including all the dc and RF pads.
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