大批量生产中减少CMP变化的多阶段工艺优化

Russell McCabe, R. Chaudhuri, S. Spangler, Lauren Kerstetter, Femi Aborisade, Raita Hoech
{"title":"大批量生产中减少CMP变化的多阶段工艺优化","authors":"Russell McCabe, R. Chaudhuri, S. Spangler, Lauren Kerstetter, Femi Aborisade, Raita Hoech","doi":"10.1109/asmc54647.2022.9792519","DOIUrl":null,"url":null,"abstract":"Reducing reworks in manufacturing process is important for product quality, as well cycle time and cost impact. Contact oxide stop on film process has historically had one of the higher rework percentages due to underpolish. Variation in the process from various sources leading to thickness variation and challenges in process control, lead to these reworks. A multiple phase process conversion was started with intent of reducing cost, as well as reducing process variation, that results in the reworks.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Multiphased Process Optimization for CMP Variation Reduction in High Volume Manufacturing\",\"authors\":\"Russell McCabe, R. Chaudhuri, S. Spangler, Lauren Kerstetter, Femi Aborisade, Raita Hoech\",\"doi\":\"10.1109/asmc54647.2022.9792519\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Reducing reworks in manufacturing process is important for product quality, as well cycle time and cost impact. Contact oxide stop on film process has historically had one of the higher rework percentages due to underpolish. Variation in the process from various sources leading to thickness variation and challenges in process control, lead to these reworks. A multiple phase process conversion was started with intent of reducing cost, as well as reducing process variation, that results in the reworks.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792519\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792519","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

减少制造过程中的返工对产品质量、周期时间和成本影响都很重要。由于未抛光,接触氧化物止光膜工艺历来具有较高的返工率之一。各种来源的工艺变化导致厚度变化和工艺控制方面的挑战,导致这些返工。多阶段过程转换开始的目的是降低成本,以及减少导致返工的过程变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multiphased Process Optimization for CMP Variation Reduction in High Volume Manufacturing
Reducing reworks in manufacturing process is important for product quality, as well cycle time and cost impact. Contact oxide stop on film process has historically had one of the higher rework percentages due to underpolish. Variation in the process from various sources leading to thickness variation and challenges in process control, lead to these reworks. A multiple phase process conversion was started with intent of reducing cost, as well as reducing process variation, that results in the reworks.
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