板样中的多通道机电阻抗结构诊断

Funmilola Nwokocha, Andrei N. Zagrai, David Hunter
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引用次数: 0

摘要

为了节约成本和提高结构的安全性,结构健康监测变得越来越重要。利用薄压电片有源传感器测量结构/传感器集成系统的机电阻抗是监测结构健康状况的方法之一。这些晶圆已被证明在结构诊断中是有效的,因为它们可以作为它们所连接的结构的致动器和传感器。在这个贡献中,一个多通道单元,它是一个单一的小型化机电阻抗单元的安排,被用来测量一个复杂的板结构的机电阻抗。通过测量悬臂梁的阻抗特征,并将结果与台式阻抗分析仪HP4192A的结果进行比较,对多通道单元进行了验证。采用COMSOL多物理场有限元软件对二维结构进行了数值模拟。通过将数值模拟得到的机电阻抗数据与分析和实验数据进行比较,验证了这一点。对每个连接到试样表面的传感器进行了数值模拟,并对结果进行了分析。同时在同一频段内对试件上的所有传感器进行激励,并将各传感器的机电阻抗数据与仅对一个传感器进行激励时的机电阻抗数据进行比较。对结果进行了分析和讨论。对所有传感器同时受激的试样进行了数值模拟,并与实验数据进行了比较。多通道单元也被用于板试件的损伤检测。在试件中引入结构损伤,并测量了损伤试件的机电阻抗特征。分析了该结果,并与同一频段原始试样的结果进行了比较。对各传感器采集的数据进行了分析和讨论。强调了压电传感器在结构损伤检测中的效率,提出了传感器位置对结构损伤检测精度的影响。这为结构损伤检测提供了最佳的传感器位置。最后,利用多通道单元测量各传感器同时激励下试件在不同频率下的损伤检测。对得到的机电阻抗数据进行了分析,并与原始试件和单频段的机电阻抗数据进行了比较。探讨了压电传感器在不同频带同时检测损伤的能力。对多通道机电阻抗法在结构健康监测中的应用提出了建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multichannel Electromechanical Impedance Structural Diagnostics in Plate Specimens
Structural health monitoring has become increasingly important in order to save costs and improve the safety of structures. One of the methods of monitoring the health of structures is the use of thin piezoelectric wafer active sensors to measure the electromechanical impedance of the integrated structure/sensor system. These wafers have proved to be efficient in structural diagnostics as they serve as both actuator and sensor for the structures they are attached to. In this contribution, a multichannel unit, which is an arrangement of single miniaturized electro-mechanical impedance units, is utilized to measure the electromechanical impedance of a complex plate structure. The multi-channel unit was validated by measuring the impedance signature of a cantilevered beam and comparing the results with those obtained using a desktop impedance analyzer, the HP4192A. A numerical modelling of 2D structures was performed using finite element analysis on COMSOL multiphysics software. This was validated by comparing the electromechanical impedance data obtained from the numerical modelling with analytical and experimental data. The specimen was numerically modelled for each sensor bonded to its surface and the results were analyzed. Furthermore, all the sensors on the specimen were simultaneously excited within the same frequency band and the electromechanical impedance data from each sensor was compared with those from same sensor when only one sensor was excited. The results were analyzed and discussed. A numerical modelling of the specimen with all the sensors simultaneously excited was also carried out and the results were compared with experimental data. The multi-channel unit was also used for damage detection in plate specimens. Structural damage was introduced in the specimen and the electromechanical impedance signatures of the damaged specimen was measured. The result was analyzed and compared with results obtained from the pristine specimen in the same frequency band. The data from each sensor was analyzed and discussed. The efficiency of piezoelectric sensors for detecting damages in structures was highlighted and the effect of sensor location on the accuracy of detecting damages in structures was presented. This suggests optimum sensor location for damage detection in structures. Finally, the multichannel unit was used to measure damage detection in the specimen at different frequencies when excited simultaneously by all sensors. The electromechanical impedance data obtained was analyzed and compared with data from the pristine specimen and in the single frequency band. The ability of piezoelectric sensor to detect damages in simultaneously varying frequency bands was explored. Recommendations for the application of the multichannel electro-mechanical impedance approach in structural health monitoring were given.
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