材料和信息流如何影响晶圆厂的性能?

D. Scott
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引用次数: 1

摘要

从历史上看,人们对改进半导体制造中使用的物理、化学和工艺技术给予了很大的关注。这种关注产生了显著的效果。自成立以来,半导体行业已经实现了任何其他行业无法比拟的生产力提高。缩小的特征尺寸、更大的晶圆、良率的提高和其他生产力的提高都促成了这一成功。然而,大多数已知的技术能力将在10-15年内接近或达到其极限。与过去相比,更大的晶圆和更高的产量对生产率提高的贡献已经越来越小,导致生产率曲线上的差距越来越大。本文讨论了自动化的材料和信息流如何能够帮助缩小生产力曲线中的差距,以及已经实现的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
How do material and information flows impact fab performance?
Historically, a lot of attention has been given to improving the physics, the chemistry and the process technologies used in semiconductor manufacturing. This focus has produced dramatic results. Since its inception, the semiconductor industry has achieved productivity improvements unmatched by any other industry. Shrinking feature sizes, larger wafers, yield improvements and other productivity gains have contributed to this success. However, most of the known technological capabilities will be approaching or have reached their limits within 10-15 years. Already, larger wafers and improved yields are making a smaller contribution to productivity improvements than they have in the past, creating a widening gap in the productivity curve. This paper discusses how automated material and information flow can help close this gap in the productivity curve, and results that have been achieved.
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