Analysis of Multilayer Conducdor Interconnects of Integrated Circuits

The present paper deals with the analysis approach of multiconductor microstrip systems an integrated circuits using the finite element method (FEM). And we look for the best dimensions of the tracks for minimized the electromagnetic interaction in order to adapt them in microtechnology. Interconnects are multiple strip and multilevel in ICs. Today interconnects are great attention in high speed digital design and microwave integrated circuit application. With increased density of packing, line to line coupling of electromagnetic also becomes prominent. Computation of the matrices of capacitances, inductances per unit length of multiconductor is important since these elements are essential parameters in designing of package.