IBM Power5总线设计用于开模块和关模块连接

Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI:10.1109/EPEP.2004.1407577

D. Dreps, F. Ferraiolo, A. Haridass, R. Reese, J. Schiff, B. Truong

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引用次数: 1

摘要

本文概述了为1:1模块上总线和2:1模块外总线所做的接口选择。使用的定制电路，数据恢复方法，信号完整性设计和使用基于寄存器的诊断和眼缘映射的系统验证。说明了基于硬件的验证方法严重依赖于基于接口寄存器的诊断和余量映射。

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IBM Power5 bus designs for on- and off-module connections

This work overviews the interface choices made for the 1:1 on-module buses and the 2:1 off-module buses. Custom circuits used, data recovery methods, signal integrity design and the system verification using register based diagnostics and eye margin mapping. The hardware based verification methods that heavily rely on the interface register based diagnostics and margin mapping are explained.

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Electrical Performance of Electronic Packaging - 2004

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