电磁仿真测试板支持系统的封装测试

Proceedings of the 2003 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference - IMOC 2003. (Cat. No.03TH8678) Pub Date : 2003-11-17 DOI:10.1109/IMOC.2003.1244909

G. Surbeck, C. Jackson

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引用次数: 0

摘要

介绍了一种用于封装射频接收系统(SiP)测试的印刷电路板模型。可以为SMA、印刷电路测试板和封装插座安装创建单个3D EM模型。与集总元件等效电路相比，该模型对实测数据的匹配性更好。该模型提供了一个完整的双端口网络，无法进行直接测量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electromagnetic simulation of a test board to support system in package testing

A model of a printed circuit board used to test an RF receiver system in package (SiP) is presented. A single 3D EM model can be created for the SMA, printed circuit test board, and package socket mount. The model gives a superior match to measured data compared to a lumped element equivalent circuit. The model provides a full two-port network where a direct measurement cannot be made.

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Proceedings of the 2003 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference - IMOC 2003. (Cat. No.03TH8678)

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