{"title":"Sn-Bi-In低温焊料的设计与性能","authors":"Qin Li, Y. Lei, Jian Lin, Sai Yang","doi":"10.1109/ICEPT.2015.7236635","DOIUrl":null,"url":null,"abstract":"Sn-Bi-In low-temperature solder was fabricated by adding In element to tin-bismuth series solder. In this paper, to study the solders with melting temperature around 110°C for replacing the toxic 26Sn-54Bi-20Cd alloy, the microstructures, thermal properties, wettabilities and microhardness of solders were studied respectively. The results show that the microstructure of Sn-Bi-In solders is composed of BiIn2 matrix, InSn4 and Bi phases, and transformed to Sn-rich matrix, Bi and InBi phases with the In content reduction. In addition, the melting temperatures of solders with 12wt% In content are around 101.5-103.1°C. Wettability is affected by compositions and the increase of Sn content to 50wt% can promote the spreading of solders. Microhardness can be increased by Bi addition and In reduction. Based on these properties study, 50Sn-38Bi-12In solder is comparable to 26Sn-54Bi-20Cd solder, and could be used in the special low-temperature welding.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Design and properties of Sn-Bi-In low-temperature solders\",\"authors\":\"Qin Li, Y. Lei, Jian Lin, Sai Yang\",\"doi\":\"10.1109/ICEPT.2015.7236635\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Sn-Bi-In low-temperature solder was fabricated by adding In element to tin-bismuth series solder. In this paper, to study the solders with melting temperature around 110°C for replacing the toxic 26Sn-54Bi-20Cd alloy, the microstructures, thermal properties, wettabilities and microhardness of solders were studied respectively. The results show that the microstructure of Sn-Bi-In solders is composed of BiIn2 matrix, InSn4 and Bi phases, and transformed to Sn-rich matrix, Bi and InBi phases with the In content reduction. In addition, the melting temperatures of solders with 12wt% In content are around 101.5-103.1°C. Wettability is affected by compositions and the increase of Sn content to 50wt% can promote the spreading of solders. Microhardness can be increased by Bi addition and In reduction. Based on these properties study, 50Sn-38Bi-12In solder is comparable to 26Sn-54Bi-20Cd solder, and could be used in the special low-temperature welding.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236635\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236635","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design and properties of Sn-Bi-In low-temperature solders
Sn-Bi-In low-temperature solder was fabricated by adding In element to tin-bismuth series solder. In this paper, to study the solders with melting temperature around 110°C for replacing the toxic 26Sn-54Bi-20Cd alloy, the microstructures, thermal properties, wettabilities and microhardness of solders were studied respectively. The results show that the microstructure of Sn-Bi-In solders is composed of BiIn2 matrix, InSn4 and Bi phases, and transformed to Sn-rich matrix, Bi and InBi phases with the In content reduction. In addition, the melting temperatures of solders with 12wt% In content are around 101.5-103.1°C. Wettability is affected by compositions and the increase of Sn content to 50wt% can promote the spreading of solders. Microhardness can be increased by Bi addition and In reduction. Based on these properties study, 50Sn-38Bi-12In solder is comparable to 26Sn-54Bi-20Cd solder, and could be used in the special low-temperature welding.
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