晶圆检测中最优采样策略的发展

International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI:10.1109/ISSM.1994.729441

R. Nurani, R. Akella, A. Strojwas, R. Wallace, M. McIntyre, J. Shields, I. Emami

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引用次数: 27

摘要

本文提出了一种用于缺陷检测的最佳抽样策略的开发方法，这对于最先进技术的良率管理至关重要。这需要理解缺陷-良率关系和良率降低过程漂移模型。此外，抽样计划是基于抽样成本和缺陷模具之间的权衡。我们的方法是用来自不同晶圆厂的数据来证明的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development Of An Optimal Sampling Strategy For Wafer Inspection

This paper presents a methodology for the development of an optimal sampling strategy for defect inspection, which is crucial for yield management of state-of-the-art technologies. This requires understanding of the defect-yield relationship and yield reducing process drift models. Further, the sampling plan is based on the trade-offs between the costs of sampling and of defective dies. Our methodology is demonstrated using data from different fabs.

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International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM

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