{"title":"用线法快速提取多层多导体互连的电容矩阵","authors":"Xiao-hong Jiang, K. Wu, W. Hong, W. Dai","doi":"10.1109/MCMC.1997.569351","DOIUrl":null,"url":null,"abstract":"In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines\",\"authors\":\"Xiao-hong Jiang, K. Wu, W. Hong, W. Dai\",\"doi\":\"10.1109/MCMC.1997.569351\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology.\",\"PeriodicalId\":412444,\"journal\":{\"name\":\"Proceedings 1997 IEEE Multi-Chip Module Conference\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-02-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1997 IEEE Multi-Chip Module Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1997.569351\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1997 IEEE Multi-Chip Module Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1997.569351","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines
In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology.
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