超快速正栅偏置应力(<100ns)理解功率p-GaN hemt的空穴注入

Zhen-Hong Huang, Wei-Syuan Lin, T. Lo, Shun-Wei Tang, Szu-Chia Chen, D. Wellekens, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, Tian-Li Wu
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引用次数: 0

摘要

本文首次报道了p-GaN hemt中的超快速正栅极偏置应力(<100ns),用于研究功率p-GaN hemt中的空穴注入/捕获现象,包括来自时间相关TCAD模拟的分析。结果表明,在超快正栅极偏压下,由空穴注入和捕获引起的负阈值电压(VTH)偏移可以最小化,这表明p-GaN功率hemt有望实现不受PBTI不稳定性影响的快速导通操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultra-Fast Positive Gate Bias Stress (<100ns) to Understand the Hole Injection in Power p-GaN HEMTs
Ultra-fast positive gate bias stress (<100ns) in p-GaN HEMTs is reported for the first time to investigate the hole injection/trapping phenomena in power p-GaN HEMTs, including the analysis from the time-dependent TCAD simulations. The results indicate that the negative threshold voltage (VTH) shift caused by the hole injection and trapping can be minimized under the ultra-fast positive gate bias, suggesting that p-GaN power HEMTs are promising for the fast turn-on operation that can be immune to PBTI instability.
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