高达10,000g冲击载荷下SAC305焊料PCB的健康监测和故障特征向量识别

P. Lall, Tony Thomas, K. Blecker
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引用次数: 4

摘要

本文主要研究了PCB在不同冲击载荷条件下的损伤预测。测试板为JEDEC标准JESD22-B111规定尺寸的多层FR4, 12个封装呈矩形排列。本文利用从电路板不同位置采集的应变信号,研究了不同跌落载荷和冲击载荷下裸印刷电路板的健康监测。测试板承受3,000、5,000、7,000和10,000g加速度的不同冲击载荷,以了解在这些不同冲击水平下封装的失效情况。此外,还对同一测试板上的不同冲击载荷进行了分析,以了解特征向量在不同载荷条件下预测失效的有效性。在每次跌落过程中,从测试板的四个不同位置获得的应变信号用于识别可以预测故障的特征向量。包装的电阻测量用于识别在下降过程中包装的失效。从固定在测试板四个不同位置的应变片获得的应变信号来研究PCB的健康状况。对应变信号进行处理,根据应变信号的时域和频域特征,识别各种特征向量,预测封装在跌落过程中的失效。时域特性量化了阻尼应变信号各峰的形状和轮廓的变化,频域研究了测试板每次跌落过程中频率分量的特征变化。采用不同的数据处理算法对应变信号和应变信号的频率分量进行降维和特征提取。对比研究了四种应变信号在不同载荷条件下的差异、特征向量在不同载荷条件下的可持续性以及特征向量随应变片位置的差异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g
This paper focusses on the prognostics of damage for a PCB under varying conditions of shock loads. The test board is a multilayer FR4 of JEDEC standard JESD22-B111 specified dimension with 12 packages that are arranged in a rectangular pattern. Health monitoring of the bare printed circuit boards under different drop and shock loads are studied in this analysis from the strain signals acquired from different locations of the board. The test boards are subjected to different shock loads of 3,000, 5000, 7000, and 10,000g acceleration to understand the failure of the packages during these various shock levels. Further, the analysis of varying shocks loads on the same test boards was also carried out to understand the effectiveness of the feature vector in predicting failure during varying load conditions. The strain signals that are acquired from four different locations of the test board during each drop are used for the identification of feature vectors that can predict the failure. The resistance measurements of the packages are used to identify the failure of packages during the drop. The health of the PCB is studied from the strain signal acquired from the strain gauges fixed at four different locations of the test board. The strain signals are processed, and various feature vectors are identified to predict the failure of the package during drop based on the time-domain and frequency-domain characteristics of the strain signal. The time-domain characteristics quantified the variation of the shape and profile of each peak of the damped strain signal, and the frequency-domain studied the characteristic change in the frequency components during each drop of the test board. Different data processing algorithms are used in dimension reduction and feature extraction from the strain signal and frequency components of the strain signal. A comparative study on the difference in the four strain signals under varying conditions of the load and sustainability of the feature vectors at different conditions of load and differences in the feature vectors with the position of the strain gauge is also studied.
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