2nm节点高性能计算和移动SoC应用的前端和后端功率传输网络指南

J. Lee, J. Jeong, S. Lee, J. Lim, S. C. Song, S. Ekbote, N. Stevens-Yu, D. Greenlaw, R. Baek
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引用次数: 0

摘要

我们首次提出了在$2\ mathm {~nm}$节点中使用前端(FS)或后端(BS)供电网络(PDN)的选择指南。分析了各种FS和BS-PDN结构在高性能计算(HPC)和移动SoC应用中的IR下降。对于移动soc来说,BS-PDN的附加工艺成本(PC)应该是基于纳米片FET (NSFET)的前端成本的5.9%,但对于高性能PC来说,要在类似IR下降的情况下具有成本效益,则要高得多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Front-side and Back-side Power Delivery Network Guidelines for 2nm node High Perf Computing and Mobile SoC applications
For the first time, we propose selection guidelines for using the front-side (FS) or back-side (BS) power delivery network (PDN) in a $2\mathrm{~nm}$ node. IR drop of various FS and BS-PDN structures have been analyzed for high-performance computing (HPC) and mobile SoC applications. Added process cost (PC) of BS-PDN should be $\lt 5.9\%$ of nanosheet FET (NSFET) based front-side cost for mobile SoCs, but much higher $\lt 10.9\%$ for HPCs, to be cost-effective at similar IR drop.
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