模拟旋转膜的平面化特性

Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference Pub Date : 1989-06-12 DOI:10.1109/VMIC.1989.78041

L. White

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引用次数: 0

摘要

只提供摘要形式。描述了可用于预测抗蚀剂和自旋玻璃(SOG)材料的平面化性能的自旋膜轮廓建模和表征程序。这些参数与自旋溶液的性能有关，可用于设计自旋膜的性能和工艺，以获得特定的平面化结果。给出了描述自旋膜轮廓的方程。方程中出现的参数可用于预测任何复杂地形和多个旋涂涂层的平面化性能。由于质量损耗效应，SOG薄膜需要特殊的建模考虑，因为它们的薄纺丝膜厚度通常远小于台阶高度

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Modelling spin-on film planarization properties

Summary form only given. A description is given of spun-on film contour modeling and characterization procedures that can be used to predict the planarization properties presented for resist and spin-on glass (SOG) materials. These parameters are related to spun-on solution properties and can be used to design spin-on film properties and processes to obtain specific planarization results. An equation describing the spin-on film contour is presented. The parameters appearing in the equation can be used to predict planarization properties on any complex topography and with multiple spun-on coatings. SOG films require special modeling considerations due to mass depletion effects, since their thin spun-on film thicknesses are typically much less than the step height.<>

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Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference

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