低功耗设计的最佳屏蔽/间距指标

Ravishankar Arunachalam, Emrah Acar, S. Nassif
{"title":"低功耗设计的最佳屏蔽/间距指标","authors":"Ravishankar Arunachalam, Emrah Acar, S. Nassif","doi":"10.1109/ISVLSI.2003.1183442","DOIUrl":null,"url":null,"abstract":"Noise arising from line-to-line coupling is a major problem for deep submicron design, and present technology trends are causing an increase in this type of noise. Common current methods to decrease coupling noise include shielding and buffering, both of which can increase overall power dissipation. An alternative method is spacing, which has the added benefit of improving the manufacturability (i.e. defect insensitivity) of the design. This paper explores the issue of coupling noise reduction, and proposes performance metrics that can be used by the designer to determine which of the alternative methods is best suited for a specific interconnect configuration.","PeriodicalId":299309,"journal":{"name":"IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings.","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"86","resultStr":"{\"title\":\"Optimal shielding/spacing metrics for low power design\",\"authors\":\"Ravishankar Arunachalam, Emrah Acar, S. Nassif\",\"doi\":\"10.1109/ISVLSI.2003.1183442\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Noise arising from line-to-line coupling is a major problem for deep submicron design, and present technology trends are causing an increase in this type of noise. Common current methods to decrease coupling noise include shielding and buffering, both of which can increase overall power dissipation. An alternative method is spacing, which has the added benefit of improving the manufacturability (i.e. defect insensitivity) of the design. This paper explores the issue of coupling noise reduction, and proposes performance metrics that can be used by the designer to determine which of the alternative methods is best suited for a specific interconnect configuration.\",\"PeriodicalId\":299309,\"journal\":{\"name\":\"IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings.\",\"volume\":\"68 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-02-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"86\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISVLSI.2003.1183442\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISVLSI.2003.1183442","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 86

摘要

线对线耦合产生的噪声是深亚微米设计的一个主要问题,目前的技术趋势正在导致这类噪声的增加。目前常用的降低耦合噪声的方法包括屏蔽和缓冲,这两种方法都会增加整体功耗。另一种方法是间隔,它具有提高设计的可制造性(即缺陷不敏感性)的附加好处。本文探讨了耦合降噪问题,并提出了设计人员可以使用的性能指标,以确定哪种替代方法最适合特定的互连配置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimal shielding/spacing metrics for low power design
Noise arising from line-to-line coupling is a major problem for deep submicron design, and present technology trends are causing an increase in this type of noise. Common current methods to decrease coupling noise include shielding and buffering, both of which can increase overall power dissipation. An alternative method is spacing, which has the added benefit of improving the manufacturability (i.e. defect insensitivity) of the design. This paper explores the issue of coupling noise reduction, and proposes performance metrics that can be used by the designer to determine which of the alternative methods is best suited for a specific interconnect configuration.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信