A. Armigliato, R. Balboni, A. Benedetti, S. Frabboni, A. Tixier, J. Vanhellemont
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引用次数: 8
摘要
应用会聚束电子衍射技术(CBED)测定了硅衬底上Si 1-x Ge x /Si异质结构及以下图像化薄膜的晶格应变。在异质结构的情况下,通过将各向同性弹性理论应用于沿不同晶体学方向测量的晶格常数,通过CBED模式中央盘的高阶劳埃区(HOLZ)线的移动,克服了在变薄的TEM样品中发生的众所周知的应力松弛问题。用这种方法得到的体应变值与从独立技术推导出的值非常吻合。在图画化结构中,CBED技术的高空间分辨率已被应用于确定氧化硅衬底中si3n4条纹诱导的应变张量分量的分布。与数值计算结果吻合较好。
Strain Measurements in Thin Film Structures by Convergent Beam Electron Diffraction
The Convergent Beam Electron Diffraction technique (CBED) has been applied to determine the lattice strain in Si 1-x Ge x /Si heterostructures and below patterned films on silicon substrates. The well known problem of the stress relaxation which occurs in thinned TEM samples has been overcome, in the case of the heterostructures, by applying the isotropic elasticity theory to the lattice constants measured along different crystallographic directions through the shift of the High Order Laue Zone (HOLZ) lines in the central disk of the CBED patterns. In this way bulk strain values have been obtained, in good agreement with values deduced from independent techniques. In patterned structures, the high spatial resolution of the CBED technique has been applied to determine the distribution of the components of the strain tensor induced into oxidized silicon substrates by Si 3 N 4 stripes. A good agreement with the results obtained using numerical computations has been found.