Klodjan Bidaj, Lauriane Gateka, Benjamin Ardaillon
{"title":"创新的WLCSP封装可靠性解决方案","authors":"Klodjan Bidaj, Lauriane Gateka, Benjamin Ardaillon","doi":"10.1109/IRPS48203.2023.10117670","DOIUrl":null,"url":null,"abstract":"This paper presents a reliability handling innovation for WLCSP product qualification. It improves reliability flow compared with standard chip board (CB) assembled WLCSP solutions. Evidence demonstrates that the concept works across a complete range of reliability stress conditions. Results with the new reliability proposal are confirmed to be similar to other standard CB solutions. This is verified through a full qualification plan on three diffusion lots using reliability trials under different environmental and bias conditions.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Innovative reliability solution for WLCSP packages\",\"authors\":\"Klodjan Bidaj, Lauriane Gateka, Benjamin Ardaillon\",\"doi\":\"10.1109/IRPS48203.2023.10117670\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a reliability handling innovation for WLCSP product qualification. It improves reliability flow compared with standard chip board (CB) assembled WLCSP solutions. Evidence demonstrates that the concept works across a complete range of reliability stress conditions. Results with the new reliability proposal are confirmed to be similar to other standard CB solutions. This is verified through a full qualification plan on three diffusion lots using reliability trials under different environmental and bias conditions.\",\"PeriodicalId\":159030,\"journal\":{\"name\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS48203.2023.10117670\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117670","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Innovative reliability solution for WLCSP packages
This paper presents a reliability handling innovation for WLCSP product qualification. It improves reliability flow compared with standard chip board (CB) assembled WLCSP solutions. Evidence demonstrates that the concept works across a complete range of reliability stress conditions. Results with the new reliability proposal are confirmed to be similar to other standard CB solutions. This is verified through a full qualification plan on three diffusion lots using reliability trials under different environmental and bias conditions.
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