{"title":"有机基板结构和设计如何提高装配的稳健性","authors":"B. Y. Low, Ravishankar Freescale","doi":"10.1109/ASQED.2009.5206269","DOIUrl":null,"url":null,"abstract":"This paper focuses on how the PBGA (plastic ball grid array) organic substrate structure and traces design improve the assembly packaging robustness. Via plugging process at the substrate fabrication has been studied. Comparison of substrate without via plug, laminate substrate with via plugging process increases the overall hardness of the substrate. This is due to the via plug materials use (IR6) is a harder materials than the solder resist. Another area of study is the addition of dummy traces design on the air venting area improves the solder resist evenness by elimination mold resin bleed.","PeriodicalId":437303,"journal":{"name":"2009 1st Asia Symposium on Quality Electronic Design","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"How organic substrate structure & design improve assembly robustness\",\"authors\":\"B. Y. Low, Ravishankar Freescale\",\"doi\":\"10.1109/ASQED.2009.5206269\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper focuses on how the PBGA (plastic ball grid array) organic substrate structure and traces design improve the assembly packaging robustness. Via plugging process at the substrate fabrication has been studied. Comparison of substrate without via plug, laminate substrate with via plugging process increases the overall hardness of the substrate. This is due to the via plug materials use (IR6) is a harder materials than the solder resist. Another area of study is the addition of dummy traces design on the air venting area improves the solder resist evenness by elimination mold resin bleed.\",\"PeriodicalId\":437303,\"journal\":{\"name\":\"2009 1st Asia Symposium on Quality Electronic Design\",\"volume\":\"91 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 1st Asia Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASQED.2009.5206269\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 1st Asia Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASQED.2009.5206269","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
How organic substrate structure & design improve assembly robustness
This paper focuses on how the PBGA (plastic ball grid array) organic substrate structure and traces design improve the assembly packaging robustness. Via plugging process at the substrate fabrication has been studied. Comparison of substrate without via plug, laminate substrate with via plugging process increases the overall hardness of the substrate. This is due to the via plug materials use (IR6) is a harder materials than the solder resist. Another area of study is the addition of dummy traces design on the air venting area improves the solder resist evenness by elimination mold resin bleed.
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