K. Miwa, T. Sawai, M. Aoyama, F. Inoue, A. Oikawa, K. Imaoka
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Particle reduction using Y2O3 material in an etching tool
Particles between metal lines were detected on etched wafers in a process tool with an Al2O3 window on top of the chamber. The particle was speculated to be derived from fluorinated Al2O3 surface in the chamber. In this paper, an attempt was described to reduce that kind of particles by using Y2O3 material within the chamber.