优化了制备稳定自由空气球(FAB)的工艺条件

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/IEMT.2008.5507781

S. H. Kim, H. Park, J. Moon

{"title":"优化了制备稳定自由空气球(FAB)的工艺条件","authors":"S. H. Kim, H. Park, J. Moon","doi":"10.1109/IEMT.2008.5507781","DOIUrl":null,"url":null,"abstract":"Recently Gold price is increased much higher. So Copper wire as low cost solution, is highlighted in various package groups. And some packages having low-pin count of thick size wire, have already been succeeded in mass production using Copper wire. If high Gold price is being kept continuously, speed of conversion for Copper wire will be accelerated.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimized conditions to make stable free air ball(FAB) for copper bonding wire\",\"authors\":\"S. H. Kim, H. Park, J. Moon\",\"doi\":\"10.1109/IEMT.2008.5507781\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently Gold price is increased much higher. So Copper wire as low cost solution, is highlighted in various package groups. And some packages having low-pin count of thick size wire, have already been succeeded in mass production using Copper wire. If high Gold price is being kept continuously, speed of conversion for Copper wire will be accelerated.\",\"PeriodicalId\":151085,\"journal\":{\"name\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2008.5507781\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2008.5507781","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

最近黄金价格上涨了很多。所以铜线作为低成本的解决方案，在各种封装组中是突出的。而一些粗线的低引脚数封装，已经成功地采用铜线量产。如果金价持续走高，铜线的转换速度将加快。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Optimized conditions to make stable free air ball(FAB) for copper bonding wire

Recently Gold price is increased much higher. So Copper wire as low cost solution, is highlighted in various package groups. And some packages having low-pin count of thick size wire, have already been succeeded in mass production using Copper wire. If high Gold price is being kept continuously, speed of conversion for Copper wire will be accelerated.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

自引率

0.00%

发文量