片上系统的故障和根本原因分析:一个工业案例研究

S. Boubezari, Jayant Chhabria
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引用次数: 0

摘要

仅给出摘要形式:本文讨论了一个关于片上系统(SoC)故障和根本原因分析的工业案例研究。该SoC具有高卡滞测试覆盖率,但单个卡滞故障会导致芯片失效,从而导致高DPPM(百万分率缺陷)。我们首先展示了诊断此故障的复杂性和问题,然后涵盖了从DFD (Design-For-Debug)开始的定位缺陷的基本诊断步骤,测试向量生成,以筛选缺陷和故障分析。本文还讨论了避免这类故障的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Failure and root cause analysis for a system-on-chip: An industrial case study
Summary form only given: This paper discusses an industrial case study on failure and root cause analysis for a system-on-chip (SoC). This SoC has high stuck-at test coverage but a single stuck-at fault causes the chip to fail which results in a high DPPM (Defect Part Per Million). We first show the complexity and issues diagnosing this failure and then cover the basic diagnosis steps localizing the defect starting from DFD (Design-For-Debug), test vector generation to screen the defect and failure analysis. A solution to avoid these type of failures is also discussed.
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