创新实践环节3C硬件安全

Jeyavijayan Rajendran, P. Song, S. Natarajan
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引用次数: 0

摘要

电子产品的持续增长,加上半导体行业的整合,将推动新的多用途soc的发展,并导致与管理多个芯片变体安全相关的新复杂性,因为它们在供应链中激增。潜在入侵的巨大攻击面给电子设备带来了越来越多的漏洞,威胁着安全、隐私和安全。Mentor Graphics正在开发一个安全的端到端平台,使SoC供应商能够创建独特的指纹SoC,以及一个安全的端到端设计IP伪装方法。SoC供应商和消费者可以保护他们的IP,在任何时候验证芯片,监控它们,并收集有关它们使用情况的分析。因此,连接的SoC供应商将能够在现场安全地提供SoC功能,提供安全的现场更新,并改善产品生命周期管理,同时保护其皇冠上的宝石IP,防止收入损失,并为客户增加差异化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Innovative practices session 3C hardware security
Michael Chen Mentor Graphics The continued growth of electronics, coupled with the consolidation of the semiconductor industry, will drive new multi-purpose SoCs and result in new complexities associated with managing the security of multiple chip variants as they proliferate in supply chain. The vast attack surface for potential intrusions poses increasing vulnerabilities in electronics devices threatening security, privacy, and safety. Mentor Graphics is developing a secure end-to-end platform that enables SoC suppliers to create unique fingerprint SoCs, and a secure end-to-end design IP camouflage methodology. SoC supplier and consumer can protect their IP, authenticate chips at any point, monitor them, and gather analytics about their usage. As a result, connected SoC suppliers will be able to securely provision SoC features in the field, provide secure field updates, and improve product lifecycle management while protecting their crown jewel IP, prevent loss of revenue, and increase differentiation to their customers.
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