确定模制空腔封装的回流成型装置

Jan Joseph Miranda, Marjorie Tinao, Olga Rivera
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引用次数: 0

摘要

本研究的目的是评估和定义合适的回流剖面设置模型腔封装参考其在其资格。回流评估使用两种回流曲线设置:1)热电偶在模制封装的顶部(改编自JEDEC 020-E工业标准);2)修改了回流曲线设置,其中热电偶位于引线上(鉴定期间的目标区域),回流温度设置为245°C和260°C。额外的可靠性测试,如防潮测试和温度循环也做了单位,以检查响应包装可靠性。结果表明,如果采用的回流曲线设置将热电偶放在设计的模制气腔封装的顶部,封装厚度为4.97 mm,顶部高度为3.15 mm(相对于引线的高度),则引线区域将经历约+10°C的δ温度。这导致了气泡泄漏试验失败,由于模具铅在回流过程中分层。考虑到JEP140关于半导体封装、封装类型和尺寸的珠状热电偶温度测量指南,模制气腔封装上的封装接口或感兴趣的区域必须连接有热电偶(即引线接口),并作为回流分析的基础,以便对封装进行准确的评估和鉴定。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Defining the Appropriate Reflow Profiling Set-up for Molded Air Cavity Package
This study aims to assess and define the appropriate reflow profiling set-up on molded air cavity packages in reference to molded packages during its qualification. The reflow evaluation was done using two reflow profile set-ups: 1) thermocouple on top of the molded package (adapted from JEDEC 020-E industry standard); 2) modified reflow profile set-up where the thermocouple was located on leads (target area during qualification) and in two reflow temperature settings at 245°C and 260°C. Additional reliability tests like moisture resistance test and temperature cycle were also done on the units to check response to package reliability. Results showed that if the reflow profile set-up adapted is putting the thermocouple on top of the designed molded air cavity package with a package thickness of 4.97 mm and top height of 3.15 mm (height with respect to the leads), a delta temperature of around +10°C will be experienced on the lead area. This had led to bubble leak test failure due to mold-lead delamination during reflow process. Taking into consideration the JEP140 guideline for the beaded thermocouple temperature measurement of semiconductor packages, package type and dimension, the package interface or area of interest on a molded air cavity package must have a thermocouple attached to it (i.e., lead interface) and be the basis for the reflow profiling to have an accurate assessment and qualification of the package.
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