2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) - 最新文献

High Density Interconnect (HDI) Socket Flow & Waprage Prediction & Characterization

Pub Date : 2022-12-07 DOI: 10.1109/EPTC56328.2022.10013256 R. Ooi, F. Costa, Sam Hsieh, E. Chiu, Wendy Xu, Dave Yu, Darwin Fan, Allen Cheng, Andrew Gattuso, Yongfu Wang, Currey Hsieh, Jeffery Toran, J. Thompson, Pierre-Louis Toussaint, Ryan Curry, L. W. Keat, R. Kulterman, H. Fu

Board-level Reliability Performance Comparison of Thin and Thick Ni plating ENEPIG Laminate LGA and BGA Packages

Pub Date : 2022-12-07 DOI: 10.1109/EPTC56328.2022.10013134 Seok–Phyo Tchun, Joo–Yeop Kim, A. Raj

Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets

Pub Date : 2022-12-07 DOI: 10.1109/EPTC56328.2022.10013279 H. K. Kannojia, G. Van Steenberge

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