用非劈裂模型研究栅极氧化物短路的表征

Chua Yong Moh, A. A'ain
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引用次数: 1

摘要

栅极氧化短路(GOS)模型的完整性是CMOS质量和可靠性指标的关键因素。MOS晶体管中的栅极氧化物缺陷可以被认为是与布局和技术相关的故障,其逻辑故障模型并不总是可用的,需要电气模型来模拟缺陷特征。以前,GOS是用两个小晶体管和集总元件的分割晶体管技术建模的。然而,由于通道长度在特定的工艺过程中被设计为最小尺寸,使用现有的单向分裂模型来研究最小尺寸晶体管受GOS故障的影响存在问题。本文对GOS的分裂模型和非分裂模型进行了比较和关联研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A study on characterization of gate oxide shorts using non-split model
The integrity of gate oxide shorts (GOS) model is a key factor as quality and reliability indicator of CMOS. Gate oxide defects in MOS transistors can be considered as the layout and technology dependent failures for which logic fault models are not always available, requiring electrical models to simulate the defect characteristics. Previously the GOS have been modeled with split transistors technique using two minor transistors and lumped elements. However, it is problematic to study minimum size transistors affected by GOS failures using the existing unidirectional split model as the channel length is designed at minimum size in particular technology process. This paper presents a study to compare and correlate between split model and non-split model of GOS.
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