谐振技术与电磁封装

2015 International Conference on Electromagnetics in Advanced Applications (ICEAA) Pub Date : 2015-10-15 DOI:10.1109/ICEAA.2015.7297218

J. Granados-Samaniego, J. M. Velázquez-Arcos, C. Vargas, F. Tavera R, R. H. Hernandez Lopez

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引用次数: 2

摘要

在所谓的共振技术的概念下，最近我们提出了一种设备，它可以传输许多不同的信号，所有这些信号都是相似的频率，尽管记录时间不同，但都包裹在共振频率周围。为了实现物理设备，我们开发了一种算法，该算法插入到FPGA中以构建信息包并发送它。同时，在考虑信号完整性和电磁宽带封装模型的基础上，对间隙波导电磁封装技术进行了分析。

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Resonant Technology and Electromagnetic Packaging

Under the concept of the so called Resonant Technology, recently we had proposed a device that can transport a lot of different signals, all of them of similar frequencies although different recording time, packed around the resonant frequencies. With the aim to implement physically the device, we had developed an algorithm, which is inserted in a FPGA to build information packs and send it. Also, we analyze the Gap Waveguide Electromagnetic Packaging Technology, taking into account the signal integrity and the Electromagnetic Broadband Packaging Model.

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2015 International Conference on Electromagnetics in Advanced Applications (ICEAA)

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