gb DRAM及以后的沟槽单元阵列通管设计

Y. Li, J. Mandelman, P. Parries, Y. Matsubara, Q. Ye, R. Rengarajan, J. Alsmeier, B. Flietner, D. Wheeler, H. Akatsu, R. Divakaruni, R. Mohler, K. Sunouchi, G. Bronner, T. Chen
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引用次数: 10

摘要

DRAM单元尺寸的积极缩放要求阵列通道晶体管的通道长度和通道宽度的最小尺寸。由于严格的泄漏电流要求,随着单元尺寸的减小,阵列MOSFET的设计变得越来越具有挑战性。在本文中,我们提供的数据说明了通道和源/漏工程的重要性,以及最小化结漏的考虑。通过利用512 k阵列诊断监视器,以统计可靠的方式提出了优化阵列单元设计的方法。设计问题独特的沟槽电容电池涵盖。还讨论了提高过程窗口的其他偏置方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Array pass transistor design in trench cell for Gbit DRAM and beyond
Aggressive scaling of the DRAM cell size requires minimum dimensions in both the channel length and the channel width of the array pass transistor. As a result of the stringent leakage current requirement, the design for the array MOSFET becomes increasingly challenging as cell size is reduced. In this paper, we present data that illustrate the importance of the channel and the source/drain engineering, along with considerations of minimizing the junction leakage. By utilizing a 512 k array diagnostic monitor, a methodology is presented for optimum array cell design in a statistically reliable manner. Design issues unique to the trench capacitor cell are covered. Alternative biasing schemes that boost the process window are also discussed.
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