在耐辐射商用亚微米CMOS工艺中,中子和质子辐照抑制闭锁

R. Lacoe, S. Moss, J. V. Osborn, B. Janousek, S. Lalumondiere, S. Brown, D. C. Mayer
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引用次数: 8

摘要

利用中子和质子辐照提高了在耐辐射的商用亚微米CMOS铸造厂制造的CMOS测试结构的锁紧率。测试结构的临界间距尺寸不同,以代表典型CMOS电路的一系列布局条件。SPICE模拟将锁相容差的变化与这些CMOS电路中寄生双极增益的降低以及阱电阻和衬底电阻的增加联系起来。结果表明,减小晶体管增益和增大电阻会对闭锁阈值产生相互竞争的影响。这些相互竞争的效应可以解释在某些质子辐照条件下观察到的初始闭锁阈值的降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Neutron and proton irradiation for latchup suppression in a radiation-tolerant commercial submicron CMOS process
Neutron and proton irradiations have been used to improve the latchup susceptibility of CMOS test structures fabricated at a radiation-tolerant commercial submicron CMOS foundry. The test structures were varied in critical spacing dimensions to represent a range of layout conditions in typical CMOS circuits. SPICE simulations were used to relate changes in latchup tolerance to reduced parasitic bipolar gains and increased well and substrate resistances in these CMOS circuits. It is shown that decreasing transistor gains and increasing resistances can have competing influences on latchup threshold. These competing effects can explain the observed initial reduction in latchup threshold for some proton irradiation conditions.
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