血小板填充聚合物-陶瓷复合材料的初步有限元热模拟

R. F. Hill, J.L. Strader
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引用次数: 10

摘要

为了提高聚合物材料的热性能,它们可以用本质上高导热的填料填充,通过所得到的复合材料提供导热路径。为了预测导热系数作为填料导热系数、取向和聚合物基体导热系数等变量的函数,采用有限元分析方法对装载有血小板状填料的聚合物的热性能进行了建模。将建模结果与实验数据进行了比较。通过模型预测了基体电导率对聚合物-陶瓷复合材料电导率的强烈影响,并通过实验证实了这一点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites
In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.
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