{"title":"基于锗预非晶化PMOS的100nm CMOS逻辑增强技术","authors":"S.T.H. Chan, F. Benistant, A. Al-Bayati","doi":"10.1109/IIT.2002.1257940","DOIUrl":null,"url":null,"abstract":"80nm physical gate length CMOS technology using germanium preamorphization implantation (Ge PAI) has been developed. With optimum Ge PAI conditions, PMOS device performance enhancement can be achieved through improved dopant activation at S/D extension region while short channel effects are also reduced. It is also shown, for the first time, that Ge PAI at S/D junction can also achieve performance enhancement depending on device architecture.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"213 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An enhanced 100nm CMOS logic technology with germanium preamorphized PMOS\",\"authors\":\"S.T.H. Chan, F. Benistant, A. Al-Bayati\",\"doi\":\"10.1109/IIT.2002.1257940\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"80nm physical gate length CMOS technology using germanium preamorphization implantation (Ge PAI) has been developed. With optimum Ge PAI conditions, PMOS device performance enhancement can be achieved through improved dopant activation at S/D extension region while short channel effects are also reduced. It is also shown, for the first time, that Ge PAI at S/D junction can also achieve performance enhancement depending on device architecture.\",\"PeriodicalId\":305062,\"journal\":{\"name\":\"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on\",\"volume\":\"213 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIT.2002.1257940\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIT.2002.1257940","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An enhanced 100nm CMOS logic technology with germanium preamorphized PMOS
80nm physical gate length CMOS technology using germanium preamorphization implantation (Ge PAI) has been developed. With optimum Ge PAI conditions, PMOS device performance enhancement can be achieved through improved dopant activation at S/D extension region while short channel effects are also reduced. It is also shown, for the first time, that Ge PAI at S/D junction can also achieve performance enhancement depending on device architecture.