用于WLAN/ISM应用的TSLP封装的17 GHz接收器，采用0.13 /spl mu/m CMOS

Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005. Pub Date : 2005-12-05 DOI:10.1109/ESSCIR.2005.1541577

C. Kienmayer, M. Engl, Aandreas Desch, R. Thüringer, Mohit Berry, M. Tiebout, A. Scholtz, R. Weigel

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引用次数: 5

摘要

这项工作提出了一种完全集成的CMOS接收器，采用无引线塑料封装(TSLP)，用于17.2 GHz ISM频段的高数据速率WLAN应用。该接收机的增益为35 dB，输入1dB压缩点为-49.6 dBm, SSB噪声系数为9.9 dB，输入IP3为-39.8 dBm。在1.5 V的电源下，包括LNA、复杂解调器、VCO、iq分压器和所有rf缓冲器的接收器仅消耗245 mW。

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17 GHz receiver in TSLP package for WLAN/ISM applications in 0.13 /spl mu/m CMOS

This work presents a fully integrated CMOS receiver in a leadless plastic package (TSLP) for high data rate WLAN applications at 17.2 GHz ISM band. The receiver offers a gain of 35 dB, input 1dB compression point of -49.6 dBm, SSB noise figure of 9.9 dB and an input IP3 of -39.8 dBm. At a power supply of 1.5 V, the receiver, which includes LNA, complex demodulator, VCO, IQ-divider and all RF-buffers, consumes only 245 mW.

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Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005.

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