32 nm节点衰减无铬相移掩模的酸扩散长度依赖性

Lithography Asia Pub Date : 2008-12-04 DOI:10.1117/12.804611
Jee-Hye You, Young-Min Kang, Mi-Rim Jung, Hye-keun Oh
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引用次数: 1

摘要

我们采用浸没光刻技术,在1.55 NA的条件下获得32 nm的节点图案,没有使用双重曝光/双重图案。将无铬相移掩模与衰减相移掩模进行了比较,得到了32 nm致密1:1的线和空间图形。我们比较了航拍图像、归一化图像对数斜率、曝光纬度和对焦深度,以了解曝光后烘烤和酸扩散长度的影响。当扩散长度大于10 nm时,两种掩模的处理窗口都迅速缩小。然而,高达20 nm的扩散长度,32 nm可以加工,如果曝光纬度的5%在生产中使用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Acid diffusion length dependency for 32-nm node attenuated and chromeless phase shift mask
We applied the immersion lithography to get 32 nm node pattern with 1.55 NA, without using double exposure / double patterning. A chromeless phase shift mask is compared with an attenuated phase shift mask to make 32 nm dense 1:1 line and space pattern. We compared the aerial image, normalized image log slope, exposure latitude, and depth of focus for each mask type in order to see the effect of the post exposure bake and acid diffusion length. The process window shrinks fast if the diffusion length is larger than 10 nm for both mask types. However, up to 20 nm diffusion length, 32 nm can be processible if the exposure latitude of 5% is used in production.
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