{"title":"基于规范降阶建模的多互连参数分析","authors":"Zhigang Hao, G. Shi","doi":"10.1109/ICASIC.2007.4415833","DOIUrl":null,"url":null,"abstract":"For design nodes at 65 nm and below, timing will essentially be a statistical measure of the fabricated circuit and heavily correlated with process variation. This paper proposes a novel parametric interconnect analysis using canonical reduced order modeling. Models in canonical forms have the feature of a small number of free model parameters. This property can be made use of effectively for parametric analysis via interpolation. Experimental results demonstrate the effectiveness of the proposed methodology.","PeriodicalId":120984,"journal":{"name":"2007 7th International Conference on ASIC","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Parametric analysis of multiple interconnects via canonical reduced order modeling\",\"authors\":\"Zhigang Hao, G. Shi\",\"doi\":\"10.1109/ICASIC.2007.4415833\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For design nodes at 65 nm and below, timing will essentially be a statistical measure of the fabricated circuit and heavily correlated with process variation. This paper proposes a novel parametric interconnect analysis using canonical reduced order modeling. Models in canonical forms have the feature of a small number of free model parameters. This property can be made use of effectively for parametric analysis via interpolation. Experimental results demonstrate the effectiveness of the proposed methodology.\",\"PeriodicalId\":120984,\"journal\":{\"name\":\"2007 7th International Conference on ASIC\",\"volume\":\"80 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 7th International Conference on ASIC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICASIC.2007.4415833\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 7th International Conference on ASIC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICASIC.2007.4415833","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Parametric analysis of multiple interconnects via canonical reduced order modeling
For design nodes at 65 nm and below, timing will essentially be a statistical measure of the fabricated circuit and heavily correlated with process variation. This paper proposes a novel parametric interconnect analysis using canonical reduced order modeling. Models in canonical forms have the feature of a small number of free model parameters. This property can be made use of effectively for parametric analysis via interpolation. Experimental results demonstrate the effectiveness of the proposed methodology.