{"title":"用于高速串行链路的 EMI 滤波器基底集成共模扼流圈","authors":"B. Wu","doi":"10.1109/EPEPS.2017.8329747","DOIUrl":null,"url":null,"abstract":"A miniaturized substrate integrated common mode chock of EMI filter is presented for high speed serial link. This novel design is implemented on a high density interconnect board. The small size of the component makes it well suitable for system integration and assembly in a highly compact situation. The common mode noise is significantly mitigated according to the post-fabrication spectrum analyses. Good agreement between simulation and measurement is reached and observed.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"153 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Substrate integrated common mode choke of EMI filter for high speed serial link\",\"authors\":\"B. Wu\",\"doi\":\"10.1109/EPEPS.2017.8329747\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A miniaturized substrate integrated common mode chock of EMI filter is presented for high speed serial link. This novel design is implemented on a high density interconnect board. The small size of the component makes it well suitable for system integration and assembly in a highly compact situation. The common mode noise is significantly mitigated according to the post-fabrication spectrum analyses. Good agreement between simulation and measurement is reached and observed.\",\"PeriodicalId\":397179,\"journal\":{\"name\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"153 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2017.8329747\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329747","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Substrate integrated common mode choke of EMI filter for high speed serial link
A miniaturized substrate integrated common mode chock of EMI filter is presented for high speed serial link. This novel design is implemented on a high density interconnect board. The small size of the component makes it well suitable for system integration and assembly in a highly compact situation. The common mode noise is significantly mitigated according to the post-fabrication spectrum analyses. Good agreement between simulation and measurement is reached and observed.