High-Voltage Driver for Fully-Integrated Piezoelectric Inkjet Printhead Module

With the help of the MEMS technology, printhead arrays can be integrated in a piezoelectric inkjet printhead (PIP) module. In this work, a fully-integrated PIP module is proposed. The 3D-packaged module connects the MEMS PIP arrays and the high-voltage driver IC by Through Silicon Via (TSV) technology. The high-voltage driver with the distributed model of TSV is designed and the joint simulations of high-voltage driver, TSV and PIP are carried out to ensure the performance of the 3D-packaged module. The prototype of the driver is designed with a high-voltage 0.18 μm CMOS technology. The maximum driving voltage is 50 V and the driving capacity is 8 channels (0.8 nF) with the slew rate of 37 V/μs.