万物互联的硅上石墨烯平台

N. Mishra, Sai Jiao, A. Mondal, Z. Khan, J. Boeckl, K. Gaskill, Ryan E. Brock, R. Dauskardt, F. Iacopi
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引用次数: 4

摘要

我们开创了一种平台技术,能够直接利用硅衬底上碳化硅的石墨烯特性,用于集成片上或封装应用,从传感和纳米光子学到集成储能。石墨烯的合成是无转移和位置选择性的,导致直接的晶圆级制造,并为后续加工提供足够的附着力。这种方法可以为万物互联智能节点的SiP系统中的小型化能源铺平道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A graphene platform on silicon for the Internet of Everything
We have pioneered a platform technology able to harness the properties of graphene directly from silicon carbide on silicon substrates for integrated on-chip or in-package applications, ranging from sensing and nanophotonics to integrated energy storage. The graphene synthesis is transfer-free and site-selective, leading to straightforward wafer-level fabrication and yielding sufficient adhesion for subsequent processing. This approach among others can pave the way towards miniaturized energy sources in SiP systems for smart nodes of the Internet of Everything.
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