Hiroyoshi Suzuki, K. Koshikawa, Takahiko Kuroda, Toshimichi Ishizuka, Fan Pin Gyue, Fang Pei Yuan, Wang Jia Ji
{"title":"提高了高倍率热成像的性能","authors":"Hiroyoshi Suzuki, K. Koshikawa, Takahiko Kuroda, Toshimichi Ishizuka, Fan Pin Gyue, Fang Pei Yuan, Wang Jia Ji","doi":"10.1109/IPFA.2009.5232602","DOIUrl":null,"url":null,"abstract":"We have developed a 30x IR sensitive lens for thermal microscopy making it possible to observe thermal images under high magnification beyond 100x in combination with a solid immersion lens. And we could find that it possible to observe thermal images with high magnification beyond 100x and high resolution as less than 1 µm line and space","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"107 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Improvement of performance for higher magnification thermal imaging\",\"authors\":\"Hiroyoshi Suzuki, K. Koshikawa, Takahiko Kuroda, Toshimichi Ishizuka, Fan Pin Gyue, Fang Pei Yuan, Wang Jia Ji\",\"doi\":\"10.1109/IPFA.2009.5232602\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed a 30x IR sensitive lens for thermal microscopy making it possible to observe thermal images under high magnification beyond 100x in combination with a solid immersion lens. And we could find that it possible to observe thermal images with high magnification beyond 100x and high resolution as less than 1 µm line and space\",\"PeriodicalId\":210619,\"journal\":{\"name\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"107 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2009.5232602\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232602","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improvement of performance for higher magnification thermal imaging
We have developed a 30x IR sensitive lens for thermal microscopy making it possible to observe thermal images under high magnification beyond 100x in combination with a solid immersion lens. And we could find that it possible to observe thermal images with high magnification beyond 100x and high resolution as less than 1 µm line and space