环烯烃聚合物的低温等离子体活化直接键合

J. Mizuno, S. Farrens, V. Dragoi, T. Glinsner, H. Ishida, H. Shinohara, Takafumi Suzuki, M. Ishizuka, S. Shoji
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引用次数: 31

摘要

采用N/sub - 2/、O/sub - 2/、10%-H/sub - 2/ Ar等不同气体进行表面等离子体处理,研究了环烯烃聚合物(COP)板(20mm /spl次/ 40mm /spl次/ 2.0 mm)的低温直接键合方法。用刀片法测定了结合界面的表面能。即使在室温下,流动装置也能获得合理的结合强度。等离子体暴露后样品表面的接触角测量表明,等离子体活化后的表面变得亲水,并且这种活化状态持续了2个月以上。该方法可用于制备单分子级光学生物检测系统的微流器件,其粘接后残余应力和变形较小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding
Low temperature direct bonding method of Cyclo-Olefin Polymer (COP) plates (20mm /spl times/ 40 mm /spl times/ 2.0 mm) has been developed employing surface plasma treatment with various gases such as N/sub 2/, O/sub 2/, and 10%-H/sub 2//Ar. Surface energy of the bonded interface has been measured by razor blade method. Reasonable bonding strength for flow devices was achieved even at room temperature. The contact angle measurements on the sample surfaces after plasma exposure indicated that the plasma activated surfaces became hydrophilic and this activated state lasted for longer than 2 months. This method is useful to fabricate micro-flow devices for single-molecule level optical bio-detection systems that requires less residual stress and deformation after bonding.
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