{"title":"24ghz ISM波段应用的3D天线设计","authors":"P. Sravani, M. Rao","doi":"10.1109/VLSID.2015.85","DOIUrl":null,"url":null,"abstract":"A novel three dimensional (3D) antenna is designed for 24 GHz frequency ISM band applications. The 3D antenna uses optimal 2D space and relies heavily on 3D structures to provide improved antenna performance. Four different 3D antenna configurations are studied to understand the improvement in the antenna design. The antenna parameters and surface current distribution are compared with patch antenna of 24 GHz frequency. The 3D configuration allows more space for device fabrication and enhance the chip functionalities. The 3D architecture consist of antenna, which is fed by quarter wave transmission line to match antenna impedance. A wave port is designed to characterize the antenna. The designed 3D antenna is compact as compared to 2D planar patch antenna of same frequency. In the 3D architecture, the current is distributed to the patch on a different plane via 3D conducting channels. The current distribution shows maximum current in the surface conducting layer for two types of the 3D antenna designed. The compact 3D antenna is designed to radiate at 24 GHz and occupies space of less than 3.75 mm × 3.75 mm in the die as compared to the space of 7.27 mm × 7.27 mm for planar patch antenna of similar frequency. The reduction in space offers wide advantages in designing on-chip RF systems. The simulation of the antennas were completed using An soft HFSS™, 3D electromagnetic tool.","PeriodicalId":123635,"journal":{"name":"2015 28th International Conference on VLSI Design","volume":"120 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Design of 3D Antennas for 24 GHz ISM Band Applications\",\"authors\":\"P. Sravani, M. Rao\",\"doi\":\"10.1109/VLSID.2015.85\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel three dimensional (3D) antenna is designed for 24 GHz frequency ISM band applications. The 3D antenna uses optimal 2D space and relies heavily on 3D structures to provide improved antenna performance. Four different 3D antenna configurations are studied to understand the improvement in the antenna design. The antenna parameters and surface current distribution are compared with patch antenna of 24 GHz frequency. The 3D configuration allows more space for device fabrication and enhance the chip functionalities. The 3D architecture consist of antenna, which is fed by quarter wave transmission line to match antenna impedance. A wave port is designed to characterize the antenna. The designed 3D antenna is compact as compared to 2D planar patch antenna of same frequency. In the 3D architecture, the current is distributed to the patch on a different plane via 3D conducting channels. The current distribution shows maximum current in the surface conducting layer for two types of the 3D antenna designed. The compact 3D antenna is designed to radiate at 24 GHz and occupies space of less than 3.75 mm × 3.75 mm in the die as compared to the space of 7.27 mm × 7.27 mm for planar patch antenna of similar frequency. The reduction in space offers wide advantages in designing on-chip RF systems. The simulation of the antennas were completed using An soft HFSS™, 3D electromagnetic tool.\",\"PeriodicalId\":123635,\"journal\":{\"name\":\"2015 28th International Conference on VLSI Design\",\"volume\":\"120 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-02-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 28th International Conference on VLSI Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSID.2015.85\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 28th International Conference on VLSI Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSID.2015.85","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
摘要
设计了一种适用于24ghz ISM频段的新型三维天线。3D天线利用最佳的2D空间，并严重依赖3D结构来提供改进的天线性能。研究了四种不同的三维天线结构，以了解天线设计的改进。并与24ghz贴片天线的天线参数和表面电流分布进行了比较。3D配置为器件制造提供了更多空间，并增强了芯片功能。三维结构由天线组成，由四分之一波传输线馈电以匹配天线阻抗。设计了一个波端口来描述天线的特性。与同频率的二维平面贴片天线相比，所设计的三维天线结构紧凑。在三维结构中，电流通过三维导电通道分布到不同平面上的贴片上。两种三维天线的电流分布均显示出最大电流在表面导电层。紧凑的三维天线被设计为24 GHz辐射，在芯片中占用的空间小于3.75 mm × 3.75 mm，而类似频率的平面贴片天线的空间为7.27 mm × 7.27 mm。空间的减小为设计片上射频系统提供了广泛的优势。利用软件HFSS™三维电磁工具对天线进行仿真。
Design of 3D Antennas for 24 GHz ISM Band Applications
A novel three dimensional (3D) antenna is designed for 24 GHz frequency ISM band applications. The 3D antenna uses optimal 2D space and relies heavily on 3D structures to provide improved antenna performance. Four different 3D antenna configurations are studied to understand the improvement in the antenna design. The antenna parameters and surface current distribution are compared with patch antenna of 24 GHz frequency. The 3D configuration allows more space for device fabrication and enhance the chip functionalities. The 3D architecture consist of antenna, which is fed by quarter wave transmission line to match antenna impedance. A wave port is designed to characterize the antenna. The designed 3D antenna is compact as compared to 2D planar patch antenna of same frequency. In the 3D architecture, the current is distributed to the patch on a different plane via 3D conducting channels. The current distribution shows maximum current in the surface conducting layer for two types of the 3D antenna designed. The compact 3D antenna is designed to radiate at 24 GHz and occupies space of less than 3.75 mm × 3.75 mm in the die as compared to the space of 7.27 mm × 7.27 mm for planar patch antenna of similar frequency. The reduction in space offers wide advantages in designing on-chip RF systems. The simulation of the antennas were completed using An soft HFSS™, 3D electromagnetic tool.
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