{"title":"从铜/聚酰亚胺tml裸基板到多模块的Mcm-D铸造","authors":"J.P. Droguet","doi":"10.1109/ICMCM.1994.753579","DOIUrl":null,"url":null,"abstract":"Description of the process, based on copper conductors and polyimid as a dielectric* (1) Description of the industrial pilot (2) Process characterization (3) Let us briefly remind, as described by fig. 1 hereunder, that the technology allows the realization of a multilayer stack, with up to five levels of conductors for power, ground, two signal layers and a top layer, for components attach and interconnect.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An Mcm-D Foundry from Copper/polyimid Tfml Bare Substrate to Multichif Modules\",\"authors\":\"J.P. Droguet\",\"doi\":\"10.1109/ICMCM.1994.753579\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Description of the process, based on copper conductors and polyimid as a dielectric* (1) Description of the industrial pilot (2) Process characterization (3) Let us briefly remind, as described by fig. 1 hereunder, that the technology allows the realization of a multilayer stack, with up to five levels of conductors for power, ground, two signal layers and a top layer, for components attach and interconnect.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753579\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753579","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An Mcm-D Foundry from Copper/polyimid Tfml Bare Substrate to Multichif Modules
Description of the process, based on copper conductors and polyimid as a dielectric* (1) Description of the industrial pilot (2) Process characterization (3) Let us briefly remind, as described by fig. 1 hereunder, that the technology allows the realization of a multilayer stack, with up to five levels of conductors for power, ground, two signal layers and a top layer, for components attach and interconnect.
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