统计仓限制:集成电路制造中晶圆位错的方法

S. Illyés, D. Baglee
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引用次数: 4

摘要

讨论了晶圆级测试中统计箱限的选择和实施方法。讨论了生产流程的改进。研究发现,sbl可以检测工艺变化,拒绝错误加工的材料,有助于包装单元的流线型,并增加这些单元的成本效益。结果表明,该方法不会增加排序流程的复杂性。实现和维护是直接和简单的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Statistical bin limits: an approach to wafer dispositioning in IC fabrication
The methodology of selecting and implementing statistical bin limits (SBLs) for wafer-level testing is discussed. Improvements in the manufacturing flow are discussed. It is found that SBLs can detect process shifts, reject misprocessed material, aid in the streamlining of packaged units, and increase the cost effectiveness of these units. It is shown that the methodology does not add to the complexity of the sort flow. Implementation and maintenance are straightforward and simple.<>
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