快速恢复硅pn结漏电流特性研究

V. Obreja, G. Dinoiu
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引用次数: 2

摘要

介绍了一些与电子辐照或金掺杂硅p-n结有关的实验事实。结辐照后,反向恢复时间缩短了一个数量级以上,但室温下反向电流的增加不超过2倍。这种结在室温至320/spl度/C时的行为表明,在反向偏置和低正向偏置下,当前制造的快速恢复结可能受到比类似标准结更高的外围表面漏电流的支配。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the nature of leakage current of fast recovery silicon pn junctions
Some experimental facts related to electron irradiated or gold doped silicon p-n junctions are presented. After junction irradiation, the reverse recovery time decreases more than order of magnitude but the reverse current increase is not more than twice near room temperature. The behavior of such junctions from room temperature up to 320/spl deg/C reveals that present-day manufactured fast recovery junctions, may be dominated by a higher peripheral surface leakage current than for similar standard junctions, both at reverse bias and low forward bias.
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