{"title":"低功耗工艺变化感知标准单元的尺寸和优化","authors":"Zia Abbas, U. Khalid, M. Olivieri","doi":"10.1109/IIRW.2013.6804189","DOIUrl":null,"url":null,"abstract":"The yield of low voltage digital circuits based on standard cell design is found to be sensitive to local gate delay and power variations due to uncorrelated intra-die parameter fluctuations. Caused by random nature of doping positions they lead to more pronounced deviations for minimum transistor sizes. The basic idea of this work is to optimize the transistor level single standard cells by making the cells more resistant for process variations.","PeriodicalId":287904,"journal":{"name":"2013 IEEE International Integrated Reliability Workshop Final Report","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Sizing and optimization of low power process variation aware standard cells\",\"authors\":\"Zia Abbas, U. Khalid, M. Olivieri\",\"doi\":\"10.1109/IIRW.2013.6804189\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The yield of low voltage digital circuits based on standard cell design is found to be sensitive to local gate delay and power variations due to uncorrelated intra-die parameter fluctuations. Caused by random nature of doping positions they lead to more pronounced deviations for minimum transistor sizes. The basic idea of this work is to optimize the transistor level single standard cells by making the cells more resistant for process variations.\",\"PeriodicalId\":287904,\"journal\":{\"name\":\"2013 IEEE International Integrated Reliability Workshop Final Report\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Integrated Reliability Workshop Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW.2013.6804189\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2013.6804189","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sizing and optimization of low power process variation aware standard cells
The yield of low voltage digital circuits based on standard cell design is found to be sensitive to local gate delay and power variations due to uncorrelated intra-die parameter fluctuations. Caused by random nature of doping positions they lead to more pronounced deviations for minimum transistor sizes. The basic idea of this work is to optimize the transistor level single standard cells by making the cells more resistant for process variations.